- 专利标题: PROCEDE ET SYSTEME DE DECOUPE EN TRANCHES D'UNE PIECE EN MATERIAU SEMI-CONDUCTEUR OU EN CERAMIQUE, A L'AIDE D'UN FIL DE DECOUPE ET DE PARTICULES ABRASIVES
- 专利标题(英): EP3402642A1 - Method and system for slicing a piece made of a semiconductor material or ceramic, using a cutting wire and abrasive particles
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申请号: EP17704395.7申请日: 2017-01-16
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公开(公告)号: EP3402642A1公开(公告)日: 2018-11-21
- 发明人: PENOT, Jean-Daniel , GRILLET, Nastasja
- 申请人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 申请人地址: 25, Rue Leblanc Bâtiment "Le Ponant D" 75015 Paris FR
- 专利权人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人地址: 25, Rue Leblanc Bâtiment "Le Ponant D" 75015 Paris FR
- 代理机构: Novaimo
- 优先权: FR1650287 20160114
- 国际公布: WO2017121900 20170720
- 主分类号: B28D5/04
- IPC分类号: B28D5/04
摘要:
In the method, the wire (1) is driven in translation in at least one direction (F2) and, during its displacement in translation (F2), it penetrates into the piece to be cut (2) via a penetration face (20A) of said piece (2). According to the invention, a cushioning layer (9A) is positioned opposite the penetration face (20A) of the piece to be cut (2) such that, before penetrating into the piece (2), the wire (1) passes through the cushioning layer (9A). If the wire (1) is driven in translation in an alternating back-and-forth motion, and penetrates into the piece to be cut (2) in alternation via two opposite penetration faces (20A, 20B), two cushioning layers (9A, 9B) are respectively positioned opposite the two penetration faces.
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