发明公开
- 专利标题: COOLING DEVICE
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申请号: EP17769882.6申请日: 2017-03-06
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公开(公告)号: EP3434198A1公开(公告)日: 2019-01-30
- 发明人: YOSHIMI Yukiharu , KAWAI Hirohisa , IKEDA Tetsuo
- 申请人: Yoshimi Inc. , Akiyama Medical Co., Ltd. , Kyushu University, National University Corporation
- 申请人地址: 127 Morioka-cho 8-chome Obu-shi, Aichi 474-0038 JP
- 专利权人: Yoshimi Inc.,Akiyama Medical Co., Ltd.,Kyushu University, National University Corporation
- 当前专利权人: Yoshimi Inc.,Akiyama Medical Co., Ltd.,Kyushu University, National University Corporation
- 当前专利权人地址: 127 Morioka-cho 8-chome Obu-shi, Aichi 474-0038 JP
- 代理机构: Patentanwälte Bals & Vogel
- 优先权: JP2016059170 20160323
- 国际公布: WO2017163837 20170928
- 主分类号: A61B17/062
- IPC分类号: A61B17/062 ; A61B17/29
摘要:
A cooling device 10 may be configured to cool a shape-memory alloy member. The cooling device 10 may include: a cooling unit 20 configured to cool the shape-memory alloy member or a part that is to make contact with the shape-memory alloy member; a refrigerant supply pipe 30, 31 including one end connected to a refrigerant supply source 34 and other end connected to the cooling unit 20, the refrigerant supply pipe 30, 31 configured to supply a refrigerant supplied from the refrigerant supply source 34 to the cooling unit 20; and a refrigerant discharge pipe 32, 33 including one end connected to the cooling unit 20, the refrigerant discharge pipe 32, 33 configured to discharge the refrigerant discharged from the cooling unit 20 from other end of the refrigerant discharge pipe 32, 33.
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