发明公开
- 专利标题: HEAT TREATMENT DEVICE
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申请号: EP18776021.0申请日: 2018-03-29
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公开(公告)号: EP3603793A1公开(公告)日: 2020-02-05
- 发明人: YANO Akihisa , OKA Tatsuya , AKITA Takahito , YAMAMOTO Taiga , SHIBUYA Hideshi , TAKEUCHI Yusuke , KAMATA Hiroyuki
- 申请人: IHI Corporation
- 申请人地址: 1-1 Toyosu 3-chome Koto-ku Tokyo 135-8710 JP
- 专利权人: IHI Corporation
- 当前专利权人: IHI Corporation
- 当前专利权人地址: 1-1 Toyosu 3-chome Koto-ku Tokyo 135-8710 JP
- 代理机构: Lamb, Martin John Carstairs
- 优先权: JP2017072206 20170331
- 国际公布: WO2018181651 20181004
- 主分类号: B01J19/00
- IPC分类号: B01J19/00 ; F28D9/02 ; F28F3/00 ; F28F27/00 ; C01B3/36
摘要:
A heat treatment device (1) utilizing heat exchange between a first fluid (M) and a second fluid (HC) includes first heat transfer bodies (7) including first flow channels (17) through which the first fluid (M, P) flows, second heat transfer bodies (9) including second flow channels (31) through which the second fluid (HC) flows, the second heat transfer bodies (9) each being stacked on the respective first heat transfer bodies (7), and a casing (53, 57) having a space (S2, S3) communicating with the second flow channels (31), the casing (53, 57) being in contact with each surface including the edge of the connection interface between each first heat transfer body (7) and each second heat transfer body (9). The first heat transfer bodies (7) each further include a third flow channel (18, 24) provided in a wall portion (19, 13) isolating the first flow channels (17) from the space (S2, S3) of the casing (53, 57). The first flow channels (17) are grooves in contact with the connection interface, and the third flow channel (18, 24) is a groove in contact with the connection interface and intersecting with a virtual line (LI, L2) connecting the first flow channels with the space (S2, S3) of the casing (53, 57) at the connection interface.
公开/授权文献
- EP3603793B1 HEAT TREATMENT DEVICE 公开/授权日:2022-12-21
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