A laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and a manufacturing method therefor. Parallel linear grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The linear grooves (20) are perpendicular to, or at an angle to, the rolling direction of the steel plate. A maximum height of edge protrusions of the linear grooves (20) does not exceed 5 µm, and a maximum height of spatters in etch-free regions between adjacent linear grooves (20) does not exceed 5 µm, and the proportion of an area occupied by spatters in the vicinity of the linear grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the etching effect of the finished steel is retained during a stress-relief annealing process. The steel is suitable for manufacturing of wound iron core transformers.