- 专利标题： MULTI-NEEDLE MODULE SUITABLE FOR SKIN PROCEDURE AT SLOPE
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申请号： EP19785281.7申请日： 2019-04-09
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公开(公告)号： EP3639873A1公开(公告)日： 2020-04-22
- 发明人: LEE, Jong-dae
- 申请人： Bomtech Electronics Co., Ltd.
- 申请人地址： 322 Gonghang-daero Gangseo-gu Seoul 07646 KR
- 专利权人： Bomtech Electronics Co., Ltd.
- 当前专利权人： Bomtech Electronics Co., Ltd.
- 当前专利权人地址： 322 Gonghang-daero Gangseo-gu Seoul 07646 KR
- 代理机构： Lavoix
- 优先权： KR20180043486 20180413
- 国际公布： WO2019199009 20191017
- 主分类号： A61M5/32
- IPC分类号： A61M5/32 ; A61M5/158 ; A61M37/00
摘要：
A multi-needle module suitable for skin procedure at slope is disclosed. The multi-needle module includes: a housing part; and a plurality of needles configured to be disposed in parallel in the housing part, wherein tips of the needles have an arrangement along a plane Sl, and the plane Sl is a plane inclined by a predetermined angle with respect to a plane P2 perpendicular to the needles.
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