Invention Publication
- Patent Title: SENSOR MODULE AND PRESSURE DISTRIBUTION SENSOR PROVIDED WITH SAME
-
Application No.: EP18844138.0Application Date: 2018-08-03
-
Publication No.: EP3647753A1Publication Date: 2020-05-06
- Inventor: ONISHI, Katsuki , TANIMOTO, Kazuhiro , YOSHIDA, Mitsunobu
- Applicant: Mitsui Chemicals, Inc.
- Applicant Address: 5-2, Higashi-Shimbashi 1-chome Minato-ku Tokyo 105-7122 JP
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: 5-2, Higashi-Shimbashi 1-chome Minato-ku Tokyo 105-7122 JP
- Agency: Hoffmann Eitle
- Priority: JP2017153933 20170809
- International Announcement: WO2019031414 20190214
- Main IPC: G01L1/16
- IPC: G01L1/16 ; G01L5/00
Abstract:
A sensor module 10 that includes a holding member 20 formed of an elastic body, a pressure bearing face 22 provided at the holding member 20 and configured to bear pressure, an adjoining face 24 provided at the holding member 20 so as to adjoin the pressure bearing face 22 and configured to undergo deformation in accordance with the pressure borne by the pressure bearing face 22, and an elongate piezoelectric substrate 12 arranged on the adjoining face 24.
Information query
