- 专利标题： POSITIONING FEATURES FOR LOCATING INLAY BOARDS WITHIN PRINTED WIRING BOARDS
-
申请号： EP19213728.9申请日： 2019-12-05
-
公开(公告)号： EP3681255A1公开(公告)日： 2020-07-15
- 发明人: COONEY, Robert C. , KUCHARSKI, David M.
- 申请人： Hamilton Sundstrand Corporation
- 申请人地址： Four Coliseum Centre 2730 West Tyvola Road Charlotte, NC 28217-4578 US
- 专利权人： Hamilton Sundstrand Corporation
- 当前专利权人： Hamilton Sundstrand Corporation
- 当前专利权人地址： Four Coliseum Centre 2730 West Tyvola Road Charlotte, NC 28217-4578 US
- 代理机构： Dehns
- 优先权： US201916242610 20190108
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H05K3/46
摘要：
A printed wiring board (PWB) assembly includes a PWB main board (102) defining a recess (104) therein. An inlay (106) is seated within the recess with a gap (108) separating between the PWB main board and the inlay. Spacers (110, 112) are included within the gap to maintain gap width between the PWB main board and the inlay.
信息查询
