- 专利标题： TREATMENT SOLUTION AND TREATMENT METHOD
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申请号： EP18910789.9申请日： 2018-10-25
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公开(公告)号： EP3770948A1公开(公告)日： 2021-01-27
- 发明人: UCHIDA, Kenya , FUKUI, Hiroyuki , UEMATSU, Ikuo , IWAMOTO, Takeaki , KWON, Eunsang
- 申请人： KABUSHIKI KAISHA TOSHIBA , Tohoku University
- 申请人地址： JP Minato-ku Tokyo 105-0023 1-1, Shibaura 1-chome; JP Sendai-shi, Miyagi 980-8577 2-1-1 Katahira Aoba-ku
- 代理机构： Hoffmann Eitle
- 优先权： JP2018144521 20180731
- 国际公布： WO2019181045 20190926
- 主分类号： H01L21/205
- IPC分类号： H01L21/205 ; A62D3/36 ; A62D101/49 ; C23C16/44
摘要：
According to one embodiment, a treatment solution is provided. The treatment solution is used for treating a byproduct stemming from a process of depositing a silicon-containing material on a member using a gas which includes silicon and halogen. The treatment solution includes at least one of an inorganic base or an organic base and being basic.
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