Provided is an apparatus for treating a surface of a medical metal. The apparatus includes a lamp unit in which a through-hole is formed and which irradiates the through-hole with ultraviolet rays, a lifting unit on which a container accommodating a medical metal is detachably disposed and which is disposed to be movable in the through-hole, and a case unit which accommodates the lamp unit and the lifting unit and includes an outer case in which an outer hole corresponding to the through-hole is formed and an inner case which is disposed inside the outer case and in which the lamp unit or the lifting unit is disposed.