发明公开
- 专利标题： SOFT ERROR RESISTANT CIRCUITRY
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申请号： EP20174193.1申请日： 2013-05-14
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公开(公告)号： EP3780090A1公开(公告)日： 2021-02-17
- 发明人: BLISH, Richard C , HOSSAIN, Timothy Z
- 申请人： Cypress Semiconductor Corporation
- 申请人地址： US San Jose, CA 95134-1709 198 Champion Court
- 代理机构： Murgitroyd & Company
- 优先权： US201213471854 20120515
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/34 ; G21F1/10 ; G21F1/08 ; H01L23/556 ; H01L23/31 ; H05K3/28
摘要：
An assembly includes an integrated circuit, a film layer disposed over the integrated circuit and having a thickness of at least 50 microns, and a thermal neutron absorber layer comprising at least 0,5% thermal neutron absorber. The thermal neutron absorber layer can be a glass layer or can include a molding compound.
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IPC分类:
