发明公开
EP3851273A1 FLOOR PANEL
审中-公开
- 专利标题: FLOOR PANEL
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申请号: EP21160872.4申请日: 2011-06-21
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公开(公告)号: EP3851273A1公开(公告)日: 2021-07-21
- 发明人: MEERSSEMAN, Laurent , VANHASTEL, Luc
- 申请人: Flooring Industries Limited, SARL
- 申请人地址: LU 8070 Bertrange 10b, Rue des Mérovingiens (ZI Bourmicht)
- 代理机构: Schacht, Benny Marcel Corneel
- 优先权: BE201100247 20110428
- 主分类号: B32B5/18
- IPC分类号: B32B5/18 ; B32B21/08 ; B32B27/30 ; E04F15/10 ; B32B38/14 ; E04F15/02 ; B32B7/12 ; B44C1/24 ; B32B37/02
摘要:
Floor panel with a wood-based substrate (6) and a top layer (7) glued on this substrate (6), wherein the top layer (7) is composed at least of a synthetic printed material film (9) and a transparent thermoplastic layer (10) situated above this print (9), wherein this floor panel (1), at least on two opposite edges (2-3), is provided with a straight or curved chamfer (38) and is provided with mechanical coupling means (18), the top layer (7) further also comprises a thermoplastic back layer (8) which is situated between said print (9) and the substrate (6), and that said chamfer (38) extends through said print and to below the global level (N1) of said print (9), and wherein said chamfer (38) is provided with a separate decorative layer (40) comprising a lacquer layer (40).
公开/授权文献
- EP3851273B1 FLOOR PANEL 公开/授权日:2021-12-22
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