- 专利标题： RAW MATERIAL FOR THIN FILM FORMATION USE FOR USE IN ATOMIC LAYER DEPOSITION METHOD, RAW MATERIAL FOR THIN FILM FORMATION USE, METHOD FOR PRODUCING THIN FILM, AND COMPOUND
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申请号： EP19869747.6申请日： 2019-09-24
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公开(公告)号： EP3862462A1公开(公告)日： 2021-08-11
- 发明人: OKADA, Nana , YOSHINO, Tomoharu , YAMASHITA, Atsushi
- 申请人： ADEKA CORPORATION
- 申请人地址： JP Arakawa-ku Tokyo 116-8554 2-35, Higashiogu 7-chome
- 代理机构： Kador & Partner PartG mbB
- 优先权： JP2018189092 20181004
- 国际公布： WO2020071175 20200409
- 主分类号： C23C16/18
- IPC分类号： C23C16/18 ; C23C16/455 ; H01L21/365
摘要：
The present invention provides a thin-film forming raw material, which is used in an atomic layer deposition method, including a compound represented by the following general formula (1):
where R 1 to R 4 each independently represent an alkyl group having 1 to 5 carbon atoms, and A 1 represents an alkanediyl group having 1 to 5 carbon atoms.
where R 1 to R 4 each independently represent an alkyl group having 1 to 5 carbon atoms, and A 1 represents an alkanediyl group having 1 to 5 carbon atoms.
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