- 专利标题: INJECTION MOLDING APPARATUS AND INJECTION MOLDING METHOD
-
申请号: EP20776670.0申请日: 2020-02-13
-
公开(公告)号: EP3932646A1公开(公告)日: 2022-01-05
- 发明人: MIN, Inki , HWANG, Cheol Hwan
- 申请人: LG Chem, Ltd.
- 申请人地址: KR Seoul 07336, 128, Yeoui-daero, Yeongdeungpo-gu,
- 代理机构: Goddar, Heinz J.
- 优先权: KR20190034619 20190326
- 国际公布: WO2020197092 20201001
- 主分类号: B29C45/07
- IPC分类号: B29C45/07 ; B29C45/26 ; B29D11/00 ; B29C45/73 ; B29C33/42 ; B29C35/02 ; B29C71/02
摘要:
An injection molding device according to an embodiment of the present disclosure includes a first mold including a first injection port through which a raw material is injected; a second mold including a heating member; a first movable mold facing the first mold or the second mold and having a first cavity formed therein; and a second movable mold facing the first mold or the second mold and having a second cavity formed therein, wherein the position of the first movable mold and the position of the second movable mold can be changed from each other.
信息查询