Invention Publication
- Patent Title: DIE ASSEMBLY FOR PRODUCING FLUID-FILLED PELLETS
-
Application No.: EP19922977.4Application Date: 2019-03-29
-
Publication No.: EP3946887A1Publication Date: 2022-02-09
- Inventor: HUANG, Wenyi , HORSTMAN, Nicholas J. , WENZEL, Jeffrey D. , GOU, Qian , SUN, Yabin , ESSEGHIR, Mohamed , YANG, Yufeng , GONG, Yonghua , MA, Weiming , YANG, Hong
- Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
- Applicant Address: US Midland, MI 48674 2040 Dow Center; US Midland, Michigan 48686 2200 West Salzburg Road
- Agency: Boult Wade Tennant LLP
- International Announcement: WO2020198921 20201008
- Main IPC: B29C48/345
- IPC: B29C48/345 ; B29C48/30
Information query
IPC分类:
