发明公开
- 专利标题: ADHESIVE COMPOSITION
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申请号: EP20810742.5申请日: 2020-05-20
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公开(公告)号: EP3974488A1公开(公告)日: 2022-03-30
- 发明人: KAKUTAKA, Kairi , YAMAMOTO, Katsumasa
- 申请人: SUMITOMO SEIKA CHEMICALS CO., LTD.
- 申请人地址: JP Kako-gun, Hyogo 675-0145 346-1, Miyanishi Harima-cho
- 代理机构: Mewburn Ellis LLP
- 优先权: JP2019094366 20190520
- 国际公布: WO2020235588 20201126
- 主分类号: C09J5/00
- IPC分类号: C09J5/00 ; C09J11/08 ; C09J201/00 ; C09J7/30
摘要:
There is provided an adhesive composition having both high adhesion force and stable adhesion performance. An adhesive composition comprising, per 100 parts by mass of a curable resin (A), 1 part by mass or more and 80 parts by mass or less of substantially spherical organic particles (B), wherein the adhesive composition is used in an application amount of 5 mg/cm 2 or more and 500 mg/cm 2 or less on an adherend.
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