- 专利标题: FABRICATION OF THIN FILM FIN TRANSISTOR STRUCTURE
-
申请号: EP21198468.7申请日: 2021-09-23
-
公开(公告)号: EP4016642A1公开(公告)日: 2022-06-22
- 发明人: SATO, Noriyuki , ATANASOV, Sarah , SHARMA, Abhishek Anil , SELL, Bernhard , KU, Chieh-Jen , TAN, Elliot , YOO, Hui Jae , LAJOIE, Travis , LE, Van , WANG, Pei-Hua , PECK, Jason , BROWN-HEFT, Tobias
- 申请人: Intel Corporation
- 申请人地址: US Santa Clara, CA 95054 2200 Mission College Boulevard
- 代理机构: 2SPL Patentanwälte PartG mbB
- 优先权: US202017129867 20201221
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/78
摘要:
Thin film transistors fabricated using a spacer as a fin are described. In an example, a method of forming a fin transistor structure includes patterning a plurality of backbone pillars on a semiconductor substrate. The method may then include conformally depositing a spacer layer over the plurality of backbone pillars and the semiconductor substrate. A spacer etch of the spacer layer is then performed to leave a sidewall of the spacer layer on a backbone pillar to form a fin of the fin transistor structure. Other embodiments may be described and claimed
信息查询
IPC分类: