- 专利标题: COMPOSITIONAL ENGINEERING OF SCHOTTKY DIODE
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申请号: EP21194481.4申请日: 2021-09-02
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公开(公告)号: EP4020599A2公开(公告)日: 2022-06-29
- 发明人: SEN GUPTA, Arnab , ALAAN, Urusa , WEBER, Justin , KUO, Charles C. , CHEN, Yu-Jin , OGUZ, Kaan , METZ, Matthew V. , SHARMA, Abhishek A. , MAJHI, Prashant , DOYLE, Brian S. , LE, Van H.
- 申请人: INTEL Corporation
- 申请人地址: US Santa Clara, CA 95054 2200 Mission College Blvd.
- 代理机构: Goddar, Heinz J.
- 优先权: US202017133599 20201223
- 主分类号: H01L29/872
- IPC分类号: H01L29/872 ; H01L29/24 ; H01L29/66 ; H01L27/10 ; H01L27/24
摘要:
Embodiments disclosed herein include semiconductor devices with Schottky diodes in a back end of line stack. In an embodiment, a semiconductor device comprises a semiconductor layer, where transistor devices are provided in the semiconductor layer, and a back end stack over the semiconductor layer. In an embodiment, a diode is in the back end stack. In an embodiment, the diode comprises a first electrode, a semiconductor region over the first electrode, and a second electrode over the semiconductor region. In an embodiment, a first interface between the first electrode and the semiconductor region is an ohmic contact, and a second interface between the semiconductor region and the second electrode is a Schottky contact.
公开/授权文献
- EP4020599A3 COMPOSITIONAL ENGINEERING OF SCHOTTKY DIODE 公开/授权日:2022-07-13
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