A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides. Ag 2 O ≧ TeO 2 ≧ V 2 O 5 ≧ Li 2 O 2 V 2 O 5 ≧ Ag 2 O + Li 2 O ≧ 40 (In the formula, [X] represents a content of component X, and the unit thereof is "mol%"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232 °C) of tin and which has high adhesiveness and stickiness.