- 专利标题： METHOD FOR INCREASING ADHESION STRENGTH BETWEEN COPPER AND AN ORGANIC MATERIAL AND REDUCING HALO AND WEDGE VOID FORMATION BY MODIFYING THE COPPER SURFACE AND/OR BY USING HETEROAROMATIC SILANE COMPOUNDS
-
申请号： EP21162439.0申请日： 2021-03-12
-
公开(公告)号： EP4057782A1公开(公告)日： 2022-09-14
- 发明人: Belova-Magri, Valentina , Ackermann, Stefanie , Michalik, Fabian , Haarmann, Philipp , Thoms, Martin , Lützow, Norbert , Knaup, Jan , Königsmann, Tatjana
- 申请人： Atotech Deutschland GmbH & Co. KG
- 申请人地址： DE 10553 Berlin Erasmusstraße 20
- 代理机构： Atotech Deutschland GmbH & Co. KG
- 主分类号： H05K3/38
- IPC分类号： H05K3/38
摘要：
The present invention relates to a method for increasing adhesion strength between a surface of a copper, a copper alloy or a copper oxide and a surface of an organic material.
信息查询
