- 专利标题: ELECTROPLATING COMPOSITION FOR DEPOSITING A CHROMIUM OR CHROMIUM ALLOY LAYER ON A SUBSTRATE
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申请号: EP21171655.0申请日: 2021-04-30
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公开(公告)号: EP4083268A1公开(公告)日: 2022-11-02
- 发明人: Yevtushenko, Oleksandra , Walter, Anke , Pape, Simon
- 申请人: Atotech Deutschland GmbH & Co. KG
- 申请人地址: DE 10553 Berlin Erasmusstraße 20
- 代理机构: Atotech Deutschland GmbH & Co. KG
- 主分类号: C25D3/06
- IPC分类号: C25D3/06 ; C25D15/00
摘要:
The present invention refers to an electroplating composition for depositing a chromium or chromium alloy layer on a substrate, said composition comprising (i) trivalent chromium ions, (ii) at least one complexing agent for the trivalent chromium ions, and (iii) at least one kind of oxide-hydroxide particles; a method for depositing a respective chromium and chromium alloy layer; a respective use of said particles; and respective substrates comprising such a chromium or chromium alloy layer.
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