- 专利标题: IMAGING DEVICE AND ELECTRONIC DEVICE
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申请号: EP22178935.7申请日: 2018-03-09
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公开(公告)号: EP4086963A3公开(公告)日: 2023-03-08
- 发明人: KUMAGAI, Yoshimichi , ABE, Takashi , YOSHITA, Ryoto
- 申请人: Sony Semiconductor Solutions Corporation
- 申请人地址: JP Atsugi-shi Kanagawa 243-0014 4-14-1 Asahi-cho
- 代理机构: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB
- 优先权: JP2017055309 20170322
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal.
A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a light shielding part that shields light between the photoelectric conversion part and the holding part are provided. The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate having a predetermined thickness. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device.
A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a light shielding part that shields light between the photoelectric conversion part and the holding part are provided. The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate having a predetermined thickness. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device.
公开/授权文献
- EP4086963A2 IMAGING DEVICE AND ELECTRONIC DEVICE 公开/授权日:2022-11-09
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