• 专利标题: STRUCTURED ASSEMBLY AND INTERCONNECT FOR PHOTOVOLTAIC SYSTEMS
  • 申请号: EP21747190.3
    申请日: 2021-01-29
  • 公开(公告)号: EP4097764A1
    公开(公告)日: 2022-12-07
  • 发明人: OKANDAN, Murat
  • 申请人: mPower Technology, Inc.
  • 申请人地址: US Albuquerque, NM 87110 5901 Indian School Road, N.E., Suite 121
  • 代理机构: Van Breda, Jacobus
  • 优先权: US202062967498 P 20200129
  • 国际公布: WO2021155266 20210805
  • 主分类号: H01L31/02
  • IPC分类号: H01L31/02 H01L31/042 H01L31/04
STRUCTURED ASSEMBLY AND INTERCONNECT FOR PHOTOVOLTAIC SYSTEMS
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