- 专利标题: ETHYLENE RESIN COMPOSITION AND FILM
-
申请号: EP21779071.6申请日: 2021-03-30
-
公开(公告)号: EP4129671A1公开(公告)日: 2023-02-08
- 发明人: SEKIYA, Keiko , SUZUKI, Masao , KUDO, Yuta
- 申请人: Prime Polymer Co., Ltd.
- 申请人地址: JP Tokyo 105-7122 5-2, Higashi-Shimbashi 1-chome Minato-ku
- 代理机构: J A Kemp LLP
- 优先权: JP2020065433 20200331
- 国际公布: WO2021200991 20211007
- 主分类号: B32B27/32
- IPC分类号: B32B27/32 ; C08F10/02 ; C08L23/08 ; C08J5/18
摘要:
According to an ethylene-based resin composition having the following requirements (1) to (4) as a material such as packaging material, a film having strength for the protection of contents and rigidity (e.g., easy opening and self-standability on packaging contents in a packaging material) in an excellent balance can be provided. (1) A melt flow rate (190°C, 2.16 kg load) is 0.1 g/10 min or more and 1.0 g/10 min or less, (2) a density is 915 kg/m 3 or more and 935 kg/m 3 or less, (3) a melt index (I21: 190°C, 21.6 kg load) is 45 or less, and (4) a ratio of the amount of heat of fusion at 120°C or higher (Hh/Ht), which is the ratio of the amount of heat of fusion (Hh) determined from a DSC curve at 120°C or higher to the total amount of heat of fusion (Ht) determined from a DSC curve of DSC measurement, is 10% or more and 55% or less.
信息查询