发明公开
- 专利标题: THIN FILM TRANSISTORS HAVING FIN STRUCTURES INTEGRATED WITH 2D CHANNEL MATERIALS
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申请号: EP22191095.3申请日: 2022-08-18
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公开(公告)号: EP4152411A1公开(公告)日: 2023-03-22
- 发明人: MAXEY, Kirby , PENUMATCHA, Ashish Verma , O'BRIEN, Kevin P. , DOROW, Chelsey , AVCI, Uygar E. , LEE, Sudarat , NAYLOR, Carl , GOSAVI, Tanay
- 申请人: INTEL Corporation
- 申请人地址: US Santa Clara, CA 95054 2200 Mission College Blvd.
- 代理机构: 2SPL Patentanwälte PartG mbB
- 优先权: US202117479155 20210920
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L29/778
摘要:
Thin film transistors having fin structures integrated with two-dimensional (2D) channel materials are described. In an example, an integrated circuit structure includes a plurality of insulator fins above a substrate. A two-dimensional (2D) material layer is over the plurality of insulator fins. A gate dielectric layer is on the 2D material layer. A gate electrode is on the gate dielectric layer. A first conductive contact is on the 2D material layer adjacent to a first side of the gate electrode. A second conductive contact is on the 2D material layer adjacent to a second side of the gate electrode, the second side opposite the first side.
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