发明公开
- 专利标题: MULTI-SLOT DIE COATER
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申请号: EP21872807.9申请日: 2021-09-13
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公开(公告)号: EP4154993A1公开(公告)日: 2023-03-29
- 发明人: LEE, Taek-Soo , JEON, Shin-Wook , CHOY, Sang-Hoon
- 申请人: LG Energy Solution, Ltd.
- 申请人地址: KR Seoul 07335 Tower 1, 108, Yeoui-daero Yeongdeungpo-gu
- 代理机构: Plasseraud IP
- 优先权: KR20200126044 20200928
- 国际公布: WO2022065778 20220331
- 主分类号: B05C5/02
- IPC分类号: B05C5/02 ; H01M4/04
摘要:
Provided is a multi-slot die coater with reduced structural vulnerability to deformation and twist in the multi-slot die coater basically including three die blocks. The multi-slot die coater according to the present disclosure is a multi-slot die coater including a lower slot and an upper slot to extrude and coat a coating solution on a surface of a continuously moving substrate through at least one of the lower slot or the upper slot, and includes a lower die block, an intermediate die block and an upper die block. The multi-slot die coater includes a bolt fastened at contact surfaces between the lower die block, the intermediate die block and the upper die block, the bolt being at such an angle that a bolt head faces an upper exit port and a lower exit port.
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