- 专利标题: METHOD FOR JOINING DISSIMILAR MATERIALS AND JOINT OF DISSIMILAR MATERIALS
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申请号: EP22197100.5申请日: 2022-09-22
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公开(公告)号: EP4155059A2公开(公告)日: 2023-03-29
- 发明人: Ueyama, Tomoyuki , Miyauchi, Takaaki
- 申请人: DAIHEN Corporation
- 申请人地址: JP Yodogawa-ku Osaka-shi, Osaka 532-8512 1-11, Tagawa 2-chome
- 代理机构: Hoffmann Eitle
- 优先权: JP2021155847 20210924
- 主分类号: B29C65/44
- IPC分类号: B29C65/44 ; B29C65/56 ; B29C65/64 ; B29C45/14 ; B29C37/00 ; B29C70/68 ; B29K23/00 ; B29K69/00 ; B29K77/00 ; B29K705/00 ; B29K705/02 ; B29K705/10 ; B29K705/12
摘要:
A method for joining dissimilar materials includes forming a first recess (100) and a second recess (110) by irradiating a surface of a first member (10) with laser light, the first recess (100) and the second recess (110) being cut into the surface obliquely at angles different from each other, and joining the second member (20) to the surface of the first member (10) with a part of the second member (20) engaging with each of the first recess (100) and the second recess (110) by melting the part of the second member (20) lower in melting point than the first member (10) to cause the part of the second member (20) to flow into each of the first recess (100) and the second recess (110) and solidifying the part of the second member (20).
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