Invention Grant
- Patent Title: SUPERCONDUCTING CHIP PACKAGE WITH IMPROVED MAGNETIC SHIELDING
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Application No.: EP21210843.5Application Date: 2021-11-26
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Publication No.: EP4187451B1Publication Date: 2024-06-26
- Assignee: Imec VZW
- Current Assignee: Imec VZW
- Current Assignee Address: Kapeldreef 75
- Agency: Patent Department IMEC
- Main IPC: G06N10/40
- IPC: G06N10/40 ; H01L23/552 ; H01L23/053
Public/Granted literature
- EP4187451A1 SUPERCONDUCTING CHIP PACKAGE WITH IMPROVED MAGNETIC SHIELDING Public/Granted day:2023-05-31
Information query
