Various embodiments related to an electronic device comprising an interposer are described. An electronic device according to one embodiment comprises: a housing; a first circuit substrate and a second circuit substrate arranged in at least a part of the housing and stacked in the housing; a first component and a second component arranged in at least a part of the first circuit substrate and at least a part of the second circuit substrate; and an interposer for electrically connecting the first circuit substrate and the second circuit substrate, wherein the interposer is arranged between the first circuit substrate and the second substrate, and can also form an arrangement space in which the first component and the second component are to be arranged between the first circuit substrate and the second circuit substrate. Other various embodiments are possible.