- 专利标题: FABRICATION OF COOLING HOLES USING LASER MACHINING AND ULTRASONIC MACHINING
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申请号: EP22215445.2申请日: 2022-12-21
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公开(公告)号: EP4201580A1公开(公告)日: 2023-06-28
- 发明人: WANG, Zhigang , RIEHL, John D. , LAZUR, Andrew J. , FERNANDEZ, Robin H. , CROTEAU, Paul F. , SRINIVASAN, Gajawalli V. , SMITH, Ashley A.
- 申请人: Raytheon Technologies Corporation
- 申请人地址: US Farmington, CT 06032 10 Farm Springs Road
- 代理机构: Dehns
- 优先权: US202117557224 20211221
- 主分类号: B23P15/02
- IPC分类号: B23P15/02 ; F01D5/14 ; B23H9/10 ; B23K26/384 ; B24B1/04 ; B23H7/38 ; F01D5/18 ; B23Q3/06 ; B23P23/02 ; B23K26/00 ; B23P25/00
摘要:
A method of machining cooling holes (64) includes providing a workpiece (60) in which a cooling hole is to be formed. The cooling hole, once formed, defines distinct first and second sections. The workpiece (60) is secured in a fixture (82) that is mounted in a first machine (84). In the first machine (84), a laser is used to drill a through-hole in a wall of the workpiece (60). The through-hole is spatially common to the first and second sections of the cooling hole. After drilling the through-hole, the fixture (82) with the workpiece (60) secured therein is removed from the first machine (84) and mounted in a second machine (86). In the second machine (86), ultrasonic machining is used to expand a portion of the through-hole to form the second section. An abrasive slurry used in the process is drained through the through-hole during the ultrasonic machining.
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