Described is a method of forming an integrated circuit (50) that comprises a plurality of conductive contact pads (60) on a surface of a first substrate (52), and a dielectric layer (54) overlying the first substrate and the conductive contact pads, which may be coupled to respective qubits (62). A second substrate (56) overlies the dielectric layer, and a plurality of superconducting contacts (58) extend through the second substrate and the dielectric layer such that each superconducting contact is aligned with and in contact with a respective conductive contact pad and may be coupled to a respective resonator (64).