- 专利标题: NBTI SUPERCONDUCTING MULTI-CORE WIRE
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申请号: EP21877428.9申请日: 2021-09-29
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公开(公告)号: EP4227427A1公开(公告)日: 2023-08-16
- 发明人: SUGIMOTO, Masahiro , KATAYAMA, Kota , II, Hideki , KATO, Tomoya
- 申请人: FURUKAWA ELECTRIC CO., LTD.
- 申请人地址: JP Chiyoda-ku Tokyo 100-8322 6-4 Otemachi 2-chome
- 代理机构: Winter, Brandl - Partnerschaft mbB
- 优先权: JP2020170630 20201008
- 国际公布: WO2022075127 20220414
- 主分类号: C22C9/06
- IPC分类号: C22C9/06 ; C22C27/02 ; H01B12/10 ; H01F6/06
摘要:
A NbTi superconducting multicore wire includes:
a core portion;
a first barrier layer arranged around the circumference of the core portion and composed of a first copper alloy including at least one element selected from Ni or Mn;
a filament assembly arranged around the circumference of the first barrier layer and including a plurality of NbTi filament assemblies each including a plurality of NbTi filaments, the plurality of NbTi filaments being at least seven NbTi filaments, embedded in a matrix composed of a second copper alloy including at least one element selected from Ni or Mn;
a second barrier layer arranged around the circumference of the filament assembly and composed of the first copper alloy; and
a stabilizing layer arranged around the circumference of the second barrier layer and composed of a metal,
in a transverse cross section perpendicular to a longer direction, the plurality of NbTi filaments in each of the NbTi filament assemblies being arranged in one or more circular shapes each having a different diameter, centering on one NbTi filament; and a plurality of NbTi filaments arranged in a circular shape in an outermost circle being arranged at approximately equal intervals along a circumferential direction.
a core portion;
a first barrier layer arranged around the circumference of the core portion and composed of a first copper alloy including at least one element selected from Ni or Mn;
a filament assembly arranged around the circumference of the first barrier layer and including a plurality of NbTi filament assemblies each including a plurality of NbTi filaments, the plurality of NbTi filaments being at least seven NbTi filaments, embedded in a matrix composed of a second copper alloy including at least one element selected from Ni or Mn;
a second barrier layer arranged around the circumference of the filament assembly and composed of the first copper alloy; and
a stabilizing layer arranged around the circumference of the second barrier layer and composed of a metal,
in a transverse cross section perpendicular to a longer direction, the plurality of NbTi filaments in each of the NbTi filament assemblies being arranged in one or more circular shapes each having a different diameter, centering on one NbTi filament; and a plurality of NbTi filaments arranged in a circular shape in an outermost circle being arranged at approximately equal intervals along a circumferential direction.
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