A camera module according to various embodiments of the disclosure may include: an image sensor (140); a substrate (110) electrically connected to the image sensor (140); a bracket (120) configured to fix the substrate (110); and a plate (130) disposed on the bracket (120) such that the width (131) of a surface of the plate (130) facing the image sensor (140) includes the width (141) of an area in which the image sensor (140) is disposed, thereby shielding at least a part of a space in which the image sensor (140) is disposed from the outside, wherein the bracket (120) may be formed by injection molding a material forming the bracket (120) in a state in which the plate (130) is inserted into a mold. Various other embodiments inferable from the specification are also possible