- 专利标题: WEARABLE ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE
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申请号: EP22749915.9申请日: 2022-01-24
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公开(公告)号: EP4274396A1公开(公告)日: 2023-11-08
- 发明人: JUNG, Sangchul , KIM, Hansang , PARK, Yonghyun
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si, Gyeonggi-do 16677 129, Samsung-ro Yeongtong-gu
- 代理机构: Nederlandsch Octrooibureau
- 优先权: KR20210015311 20210203
- 国际公布: WO2022169161 20220811
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; G02B27/01
摘要:
A wearable electronic device according to one embodiment of the present invention comprises: a housing including a first part forming a first external surface of the wearable electronic device, and a second part forming a second external surface of the wearable electronic device; at least one electronic component, which is positioned in the inner space of the housing and emits the heat; and a plurality of support structures at least partially positioned between the first part and the second part in response to the at least one electronic component, wherein: a boundary portion between the first part and the second part is at least partially positioned along a surface boundary between the first external surface and the second external surface, and includes at least one opening; and at least one separation space among the plurality of support structures enables communication with the outside space of the housing through the at least one opening. Other various embodiments are possible.
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