This application provides an aluminum alloy, an electronic device, and an aluminum alloy preparation method. The aluminum alloy, based on mass percentage, includes the following components: silicon: 8.0%-10.0%, magnesium: 0.001%-0.2%, manganese: 0.001%-0.09%, iron: 0.7%-1.3%, and strontium: 0.001%-0.05%, with a balance of aluminum and inevitable impurities, where the inevitable impurities account for ≤0.15%. The aluminum alloy has characteristics of a high heat conductivity, good molding performance, favorable corrosion resistance, and favorable mechanical properties without heat treatment.