An electronic device comprises a body, a protection film (10, 11, 12) which includes a base layer (120) disposed over a first surface of the body and an adhesive layer (110) disposed between the body and the base layer (120), wherein a thickness of the adhesive layer (120) satisfies Inequality (1): z≤5.1x+57.4⋅lny−14.7x+140.5, where z is the thickness of the adhesive layer (120) in terms of micrometers, x is a modulus of the base layer (120) determined according to the conditions of ASTM D638 in terms of gigapascals, and y is a total thickness of the protection film in terms of micrometers, a temperature is about -40 °C to about 65 °C, the thickness of the adhesive layer (110) is about 25 micrometers or more, the body comprises at least one member, and a member of the body which is disposed on a fist surface the adhesive layer (110) opposite to a second surface of the adhesive layer (110) facing the base layer (120) has a modulus of 50 gigapascals or more.