A technique for appropriately protecting electrodes of a microfluidic chip is provided. A microfluidic chip (1) includes a substrate (10), electrodes (31), insulation films (33), and a fluid holding part (20). The electrodes (31) are disposed on an upper surface of the substrate (10). The insulation films (33) cover upper surfaces of the respective electrodes (31). The insulation films (33) are comprised of an oxide film obtained by oxidizing a metal contained in the electrodes (31) or a nitride film obtained by nitriding the metal contained in the electrodes (31). The fluid holding part (20) is capable of accommodating a fluid over the insulation films (33).