发明公开
- 专利标题： CURABLE RESIN COMPOSITION
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申请号： EP22780475.4申请日： 2022-03-24
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公开(公告)号： EP4317234A1公开(公告)日： 2024-02-07
- 发明人: ABE Nobuyuki , MARUYAMA Kazuyuki
- 申请人： Namics Corporation
- 申请人地址： JP Niigata-shi, Niigata 950-3131 3993, Nigorikawa, Kita-ku
- 代理机构： Hoffmann Eitle
- 优先权： JP2021057307 20210330
- 国际公布： WO2022210261 20221006
- 主分类号： C08G59/18
- IPC分类号： C08G59/18 ; C09J4/02 ; C09J11/06 ; G03B11/04 ; G03B17/02 ; C08K5/37 ; C08L101/06 ; C09J163/00 ; C08L63/00 ; C08G75/045 ; C08K3/013 ; G02B7/02
摘要：
The present invention provides a curable resin composition which gives a cured product with lowered surface gloss, and a sealing material comprising the same. The present invention also provides a cured product obtained by curing the curable resin composition or sealing material. The present invention further provides a camera module comprising the cured product.
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