发明公开
- 专利标题: CIRCUIT MOUNTING ASSEMBLIES
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申请号: EP23197281.1申请日: 2023-09-13
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公开(公告)号: EP4340559A1公开(公告)日: 2024-03-20
- 发明人: BELISLE, Francis C. , COONEY, Robert C. , CANCIAMILLE, Catherine , YANG, Nhia
- 申请人: Hamilton Sundstrand Corporation
- 申请人地址: US Charlotte, NC 28217-4578 Four Coliseum Centre 2730 West Tyvola Road
- 代理机构: Dehns
- 优先权: US202217943980 20220913
- 主分类号: H05K7/14
- IPC分类号: H05K7/14
摘要:
A circuit mounting assembly can include a circuit board (101), a chassis (103), a sheet of thermally conductive dielectric material, and one or more fasteners configured to compress the sheet between the circuit board (101) and the chassis (103) to provide vibration isolation and electrical isolation between the chassis (103) and the circuit board (101), and to provide thermal conduction between the chassis (103) and the circuit board (101).
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