A deposition device (1) is disclosed herein for depositing components (Ca, Cb,..) on a target surface (TS) of a target (T), the deposition device comprises a donor plate (3), at least one heater element (33), a power supply (6), a target manipulation device and a controller (5) configured for controlling the power supply (6) and the target manipulation device (2;21, 22). The controller causes the power supply (6) to supply at least a first pulse (Pulse 1) of electric power to the at least one heater element (33) in a zone (32) to heat the donor plate surface (31s) in at least a first subzone (32a) of that zone to a surface temperature exceeding a threshold temperature of an adhesive specimen (7a) in said first subzone (32a). Subsequent to a change of a lateral position of the target (T) relative to the donor plate (3), the controller causes the power supply (6) to supply at least a second pulse (Pulse 2) of electric power to the heater element to heat the donor plate surface (31s) in at least a second subzone (32b) to a surface temperature exceeding a threshold temperature of the adhesive specimen (7b) in said second subzone (32b). Therewith components within a zone sharing a same heater element can be transferred independently from each other.