This application discloses a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes: a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. At least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. The rewiring layer is coupled to the first conduction structure. A signal of the die is directly led out through the first conduction structure and the rewiring layer. This saves space, reduces a wiring length and interconnection inductance, and implements a low loss and an efficient interconnection of signals between dies. A signal interconnection between the dies is implemented through the rewiring layer, and based on an impedance value of the die, circuit wiring matching the impedance value may be disposed at the rewiring layer. This does not need components used for coupling impedance, such as a capacitor, saves space, and reduces design complexity.