A cutting tool comprises a substrate and a coating film disposed on the substrate, wherein the coating film comprises a first layer and a second layer; the first layer has a hardness Hi of 25 GPa or more and 40 GPa or less; the second layer has a hardness H2 satisfying 0.5×H1≤H2≤0.9×H1; and at least one of a ratio I(200)/(I(200)+I(111)+I(220)) of I(200) of (200) plane to a sum of X-ray diffraction intensity I(200) of (200) plane, X-ray diffraction intensity I(111) of (111) plane, and X-ray diffraction intensity I(220) of (220) plane of the coating film, a ratio I(111)/(I(200)+I(111)+I(220)) of I(111) to the sum, and a ratio I(220)/(I(200)+I(111)+I(220)) of I(220) to the sum is 0.45 or more.