Methods and systems are provided for filling cracks in an environmental barrier coating and/or a thermal barrier coating (EBC/TBC). The method comprises locating a component within an enclosure of an apparatus, the component including a substrate having the EBC/TBC thereon, wherein the EBC/TBC includes cracks extending from an exterior surface of the EBC/TBC toward the substrate, reducing pressure within the enclosure to a first pressure that is less than atmospheric pressure, applying a filler slurry to the exterior surface to cover the cracks while the EBC/TBC is exposed to the first pressure, increasing the enclosure to a second pressure that is greater than the first pressure, wherein the second pressure is sufficient to cause the filler slurry on the EBC/TBC to infiltrate into and fill the cracks, and sintering the filler slurry sufficient to cure the filler slurry within the cracks.