ADHESIVE RESIN COMPOSITION AND FILM
摘要:
An adhesive resin composition, including from 60 to 95 parts by mass of an ethylenic polymer (A) including a modified ethylenic polymer (a-2) obtained by modifying at least one polymer (a-1) selected from the group consisting of an ethylene homopolymer and a copolymer of ethylene and at least one α-olefin selected from α-olefins having from 3 to 20 carbon atoms, with an unsaturated carboxylic acid and/or a derivative thereof, and from 5 to 40 parts by mass of a butene-based polymer (B) having 80 mol% or more of a structural unit derived from 1-butene, provided that the total content of the polymer (A) and the polymer (B) is 100 parts by mass, wherein the MFR (190°C and a load of 2.16 kg) is from 1 to 20 g/10 minutes.
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