- 专利标题: ADHESIVE RESIN COMPOSITION AND FILM
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申请号: EP22858485.0申请日: 2022-08-17
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公开(公告)号: EP4389847A1公开(公告)日: 2024-06-26
- 发明人: SHIGA, Ryohei
- 申请人: Mitsui Chemicals, Inc.
- 申请人地址: JP Tokyo 104-0028 2-1, Yaesu 2-chome Chuo-ku
- 专利权人: Mitsui Chemicals, Inc.
- 当前专利权人: Mitsui Chemicals, Inc.
- 当前专利权人地址: JP Tokyo 104-0028 2-1, Yaesu 2-chome Chuo-ku
- 代理机构: Hoffmann Eitle
- 优先权: JP 21133539 2021.08.18
- 国际申请: JP2022031049 2022.08.17
- 国际公布: WO2023022167 2023.02.23
- 主分类号: C09J123/26
- IPC分类号: C09J123/26 ; B32B27/00 ; B32B27/32 ; C08L23/20 ; C08L23/26 ; C09J7/35 ; C09J123/04 ; C09J123/18 ; H01M50/105 ; H01M50/121 ; H01M50/129
摘要:
An adhesive resin composition, including from 60 to 95 parts by mass of an ethylenic polymer (A) including a modified ethylenic polymer (a-2) obtained by modifying at least one polymer (a-1) selected from the group consisting of an ethylene homopolymer and a copolymer of ethylene and at least one α-olefin selected from α-olefins having from 3 to 20 carbon atoms, with an unsaturated carboxylic acid and/or a derivative thereof, and from 5 to 40 parts by mass of a butene-based polymer (B) having 80 mol% or more of a structural unit derived from 1-butene, provided that the total content of the polymer (A) and the polymer (B) is 100 parts by mass, wherein the MFR (190°C and a load of 2.16 kg) is from 1 to 20 g/10 minutes.
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