- 专利标题： BINDER COMPOSITION FOR ELECTROMECHANICAL ELEMENT POSITIVE ELECTRODE, CONDUCTIVE MATERIAL DISPERSION FOR ELECTROMECHANICAL ELEMENT POSITIVE ELECTRODE, SLURRY COMPOSITION FOR ELECTROMECHANICAL ELEMENT POSITIVE ELECTRODE, POSITIVE ELECTRODE FOR ELECTROMECHANICAL ELEMENT, AND ELECTROMECHANICAL ELEMENT
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申请号： EP22864301.1申请日： 2022-08-19
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公开(公告)号： EP4398347A1公开(公告)日： 2024-07-10
- 发明人: ITO Yukie , TAKAHASHI Naoki
- 申请人： Zeon Corporation
- 申请人地址： JP Tokyo 100-8246 6-2, Marunouchi, 1-chome Chiyoda-ku
- 专利权人： Zeon Corporation
- 当前专利权人： Zeon Corporation
- 当前专利权人地址： JP Tokyo 100-8246 6-2, Marunouchi, 1-chome Chiyoda-ku
- 代理机构： Maiwald GmbH
- 优先权： JP 21141957 2021.08.31
- 国际申请： JP2022031437 2022.08.19
- 国际公布： WO2023032717 2023.03.09
- 主分类号： H01M4/62
- IPC分类号： H01M4/62 ; C08L9/02 ; C08L61/18 ; H01M4/13 ; H01M4/139
摘要：
A binder composition for an electrochemical device positive electrode contains a polymer and an organic compound. The polymer includes a nitrile group-containing monomer unit and an alkylene structural unit. The organic compound includes not fewer than 2 and not more than 15 aromatic hydrocarbon monocycles and not fewer than 2 and not more than 15 sulfur atom-containing functional groups, on average, per one molecule.
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