Invention Publication
- Patent Title: DEPOSITION APPARATUS, METHOD FOR DEPOSITING, METHOD FOR PACKAGING A DIE IN A CHIP PACKAGE
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Application No.: EP23151545.3Application Date: 2023-01-13
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Publication No.: EP4400625A1Publication Date: 2024-07-17
- Inventor: Bruning, Fabien Jacques , Hendriks, Rob Jacob
- Applicant: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO
- Applicant Address: NL 2595 DA 's-Gravenhage Anna van Buerenplein 1
- Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO
- Current Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO
- Current Assignee Address: NL 2595 DA 's-Gravenhage Anna van Buerenplein 1
- Agency: V.O.
- Main IPC: C23C14/04
- IPC: C23C14/04 ; C23C14/54 ; C23C14/26 ; C23C14/28 ; C23C14/16 ; C23C14/08 ; B33Y10/00 ; B33Y30/00 ; B29C64/00 ; H05K3/04 ; H01L21/26 ; H01L23/00 ; B23K26/00 ; H05K1/09 ; H05K3/40
Abstract:
A deposition apparatus (1) for depositing materials (Ma, Mb, ..., Mn) on a target (T) is provided herein. The apparatus is configured to initiate ejection of a material portion from an ejection position of a donor plate (2) at a point in time that a spatial vector defined between the deposition position (ps) and the ejection position (pe) corresponds to a movement of the donor plate (2) relative to the target (T). Also a corresponding deposition method is provided.
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