DEPOSITION APPARATUS, METHOD FOR DEPOSITING, METHOD FOR PACKAGING A DIE IN A CHIP PACKAGE
Abstract:
A deposition apparatus (1) for depositing materials (Ma, Mb, ..., Mn) on a target (T) is provided herein. The apparatus is configured to initiate ejection of a material portion from an ejection position of a donor plate (2) at a point in time that a spatial vector defined between the deposition position (ps) and the ejection position (pe) corresponds to a movement of the donor plate (2) relative to the target (T). Also a corresponding deposition method is provided.
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