- 专利标题: MULTILAYERED LAYERED BODY COMPRISING A THERMAL INSULATION BODY
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申请号: EP24175913.3申请日: 2015-11-11
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公开(公告)号: EP4410539A3公开(公告)日: 2024-11-06
- 发明人: HERFURTH, Dominik , WANDLER, Markus
- 申请人: Knauf Gips KG
- 申请人地址: DE 97346 Iphofen Am Bahnhof 7
- 代理机构: Meissner Bolte Partnerschaft mbB
- 主分类号: B29C63/04
- IPC分类号: B29C63/04 ; E04B1/80 ; F16L59/065 ; B32B9/04 ; B32B5/16 ; B32B5/18 ; B32B5/24 ; B32B5/30 ; B32B7/12 ; B32B9/00 ; B32B9/06 ; B32B27/08 ; B32B15/08 ; B32B15/18 ; B32B15/20 ; B32B27/10 ; B32B27/14 ; B32B13/08
摘要:
A multilayered layered body comprising an evacuated thermal insulation body (12) having a core material (13), which is enclosed by a gas-tight film (16), wherein the thermal insulation body (12) has a first flat side (14) and a second flat side (15), which is arranged opposite of the first side, wherein the lamination layer (17) is formed by a cardboard layer and has a grammage of not less than 80 g/m 2 and not greater than 220 g/m 2 , preferably of not less than 80 g/m 2 and not greater than 120 g/m 2 .
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