- 专利标题: SENSOR CHIP AND ELECTRONIC APPARATUS
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申请号: EP24182889.6申请日: 2018-08-22
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公开(公告)号: EP4418675A2公开(公告)日: 2024-08-21
- 发明人: YASU, Yohtaro , HANZAWA, Katsuhiko
- 申请人: Sony Semiconductor Solutions Corporation
- 申请人地址: JP Atsugi-shi, Kanagawa 243-0014 4-14-1 Asahi-cho
- 专利权人: Sony Semiconductor Solutions Corporation
- 当前专利权人: Sony Semiconductor Solutions Corporation
- 当前专利权人地址: JP Atsugi-shi, Kanagawa 243-0014 4-14-1 Asahi-cho
- 代理机构: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB
- 优先权: US 1715695400 2017.09.05
- 分案原申请号: 22168750.2 2022.04.19;18853942.3 2018.08.22
- 主分类号: H04N25/71
- IPC分类号: H04N25/71
摘要:
A sensor chip includes: a pixel array unit that has a rectangular-shaped area in which a plurality of sensor elements are arranged in an array pattern; and a global control circuit, in which driving elements simultaneously driving the sensor elements are arranged in one direction, and each of the driving elements is connected to a control line disposed for each one column of the sensor elements, that is arranged to have a longitudinal direction to be along a long side of the pixel array unit. For example, the present technology can be applied to ToF sensor.
公开/授权文献
- EP4418675A3 SENSOR CHIP AND ELECTRONIC APPARATUS 公开/授权日:2024-10-02
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