- 专利标题: INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION
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申请号: EP23210904.1申请日: 2023-11-20
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公开(公告)号: EP4439673A1公开(公告)日: 2024-10-02
- 发明人: MILLS, Shaun , MANNEBACH, Ehren , KOBRINSKY, Mauro J.
- 申请人: Intel Corporation
- 申请人地址: US Santa Clara, CA 95054 2200 Mission College Boulevard
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US Santa Clara, CA 95054 2200 Mission College Boulevard
- 代理机构: Maiwald GmbH
- 优先权: US 2318126851 2023.03.27
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L21/283 ; H01L29/423 ; H01L21/336 ; H01L29/775 ; B82Y10/00
摘要:
Integrated circuit structures having backside gate connection are described. In an example, an integrated circuit structure includes a plurality of horizontally stacked nanowires or a fin. A gate stack is over the plurality of horizontally stacked nanowires or the fin. An epitaxial source or drain structure is at an end of the plurality of horizontally stacked nanowires or the fin. A conductive gate-to-contact connection is vertically beneath the epitaxial source or drain structure and vertically beneath and in electrical contact with the gate stack.
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