- 专利标题: OPTICAL INTERCONNECTION MODULES FOR HIGH RADIX SPINE-LEAF NETWORK SCALE-OUT
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申请号: EP24170465.9申请日: 2024-04-16
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公开(公告)号: EP4451577A1公开(公告)日: 2024-10-23
- 发明人: Castro, Jose M. , Pimpinella, Richard J. , Kose, Bulent , Huang, Yu
- 申请人: Panduit Corp.
- 申请人地址: US Tinley Park, Illinois 60487 18900 Panduit Drive
- 代理机构: Roberts, Gwilym Vaughan
- 优先权: US202418591928 20240229
- 主分类号: H04B10/80
- IPC分类号: H04B10/80 ; H04Q11/00
摘要:
An optical interconnection assembly and method for the deployment and scaling of optical networks employing Spine-and-Leaf architecture has Spine multi-fiber optical connectors and Leaf multi-fiber optical connectors. The Spine optical connectors of the interconnection assembly are optically connected to multi-fiber connectors of Spine switches via Spine patch cords. The leaf multi-fiber connectors are optically connected to Leaf multi-fiber connectors of Leaf switches via Leaf patch cords. A plurality of fiber optic cables in said interconnection assembly serves to optically connect every Spine multi-fiber connector to every Leaf multi-fiber connector so that every Spine switch is optically connected to every Leaf switch. The optical interconnection assembly facilitates the deployment of network Spine-and-Leaf interconnections and the ability to scale out the network by using simplified methods described in this disclosure.
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