Invention Patent
- Patent Title: Pressure-sensitive adhesive sheet
- Patent Title (中): 压敏粘合片
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Application No.: JP2006101385Application Date: 2006-04-03
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Publication No.: JP2007051269APublication Date: 2007-03-01
- Inventor: KATO KIICHIRO , TOMINO TADAHIRO , SUZUKI TOMOMI
- Applicant: Lintec Corp , リンテック株式会社
- Assignee: Lintec Corp,リンテック株式会社
- Current Assignee: Lintec Corp,リンテック株式会社
- Priority: JP2005210465 2005-07-20; JP2006101385 2006-04-03
- Main IPC: C09J7/02
- IPC: C09J7/02
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which prevents or eliminates air entrapments or blisters and has through-holes formed by heat processing without spoiling the appearance of the pressure-sensitive adhesive sheet. SOLUTION: The pressure-sensitive adhesive sheet 1 is composed of a substrate 11 and a pressure-sensitive adhesive layer 12 and has a plurality of through-holes 2 passing through from one side to the other formed by heat processing. The substrate 11 has a temperature of thermal decomposition peak of ≤450°C at which the rate of weight loss of the substrate 11 becomes largest, when it is heated in a nitrogen environment at an ascending rate of temperature of 20°C/min. The difference in temperature between the peak of heat decomposition and the peak of melting is ≤250°C. COPYRIGHT: (C)2007,JPO&INPIT
Public/Granted literature
- JP4943044B2 Pressure-sensitive adhesive sheet Public/Granted day:2012-05-30
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